The annual Electronic Packaging and Electro–Mechanical Solutions, 2018 Conference and Trade Fair will deal with providing various solutions for electronic system packaging, will present innovations and solutions for connecting mother boards, environmentally friendly innovations and solutions for server farm racks, packaging for vehicles, commercial and military packaging, racks and cabins for communication applications and for special environmental conditions, packaging materials, fasteners, solutions for heat removal and cooling in racks and packages, industrial designing, content tools, simulation, analysis and environmental test innovations, machining of metal and plastic parts, standardisation services and more. Senior lecturers from the industry and the academy, as well as guest lecturers from around the world, will take part in the conference giving lectures and presenting innovations in the packaging field, innovations in the material, coating and colouring fields, packaging solutions for special applications, production and speed modelling technologies, heat removal and cooling, electromagnetic compliance, RFI, EMC and EMI and more.

COMTEL ISRAEL will be presenting in the exhibition,with our selected manufacturers represented by COMTEL ISRAEL.

We invite you to participate in the conference and visit our booth and be exposed to the great solutions we have to offer in the field of systems, bakplanes, components and electro-mechanical solutions.

Admission to the conference and to the trade fair is free of charge; nevertheless, registration in advance is required

To set up a meeting and visit the suppliers' booth, please contact COMTEL ISRAEL  sales representative

sales@comtel.co.il - 09-7677240